| PART |
Description |
Maker |
| 2N4392CSM |
Small Signal N-Channal J-FET In a Hermetically Sealed Cermic Surface Mount Package For High Reliability Application(小信号N沟道结型场效应管（气密封口陶瓷表贴封装，高可靠性应用）) 小信号n -路通道J -在密封的六窑业表面贴装封装，高可靠性的应用场效应管（小信号沟道结型场效应管（气密封口陶瓷表贴封装，高可靠性应用）
SMALL SIGNAL N.CHANNEL J.FET IN A HERMETICALLY SEALED CERAMIC SURFACE MOUNT PACKAGE FOR HIGH RELIABILITY APPLICATIONS
|
Unisonic Technologies Co., Ltd.
SEME-LAB[Seme LAB]
SemeLAB
|
| 2SC3439 |
High hFE=400 to 1800. High collector current (Icm=3A,Ic=1.5A) Small package for mounting.
|
TY Semiconductor Co., Ltd
|
| HSU88 |
Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly
|
TY Semiconductor Co., Ltd
|
| CAE-KX |
high capacitance with small package
|
Surge Components
|
| BAS21H |
Single high-voltage switching diode in small SOD123F package
|
PHILIPS[Philips Semiconductors]
|
| PS2911-1-F3-M-A |
HIGH CTR, 4-PIN ULTRA SMALL PACKAGE FLAT-LEAD PHOTOCOUPLER
|
California Eastern Labs
|
| RYC002N05 |
0.9V Drive Nch MOSFET High speed switing. Small package(SST3).
|
TY Semiconductor Co., Ltd
|
| OCXO-20 |
HIGH RELIABILITY FOR LOW COST AGING OF -0.001 PPM/DAY IN SMALL PACKAGE
|
PETERMANN-TECHNIK
|
| MPXV6115V |
High Temperature Accuracy Integrated Silicon Pressure Sensor - Small Outline Package
|
Freescale (Motorola)
|
| ACS722LLCTR-05AB-T2 |
High Accuracy, Galvanically Isolated Current Sensor IC With Small Footprint SOIC8 Package
|
Allegro MicroSystems
|
| MCP3004T-I/SL MCP3004T-I/ST MCP3004-I/P MCP3004-I/ |
The MCP3004 10-bit Analog-to-Digital Converter (ADC) combines high performance and low power consumption in a small package, making ...
The MCP3008 10-bit Analog-to-Digital Converter (ADC) combines high performance and low power consumption in a small package, making ...
|
Microchip
|
| BD2221G-LB BD2221G-LBTR |
1ch Small Package High Side Switch ICs for USB Devices and Memory Cards
|
ROHM
|
